Final month, analyst Ming-Chi Kuo reported that OpenAI was developing an AI-agent smartphone slated for mass manufacturing in 2028. Now, Kuo suggests the timeline could have been accelerated and has additionally shared some early specs of the machine.
Based on Kuo, the OpenAI smartphone is now anticipated to enter mass manufacturing within the first half of 2027. The analyst attributes the accelerated timeline to the rising AI telephone market, together with a possible year-end IPO.
Ming-Chi Kuo additionally shared key specs of OpenAI’s AI agent-focused smartphone. Based on the analyst, MediaTek is prone to be the only SoC provider. The machine is anticipated to make use of a personalized Dimensity 9600 chipset, which shall be constructed on TSMC’s N2P course of within the second half of this yr.
Kuo provides that imaging shall be a serious focus, with the ISP tipped to function an enhanced HDR pipeline designed to enhance real-world visible sensing.
The OpenAI telephone can also be stated to incorporate a dual-NPU structure for AI workloads, together with LPDDR6 RAM and UFS 5.0 storage. On the safety entrance, it’s anticipated to assist pKVM and inline hashing.
Based on Kuo, if the event of the telephone stays on observe, whole shipments in 2027 and 2028 might hit 30 million items.